Welcome on

Filling No Problem, the blog devoted to the packaging world.

A window always open on the

packaging filling

world, hunting through curiosities, new tendencies, technological innovation in the filling, capping, orienting/unscrambling processes for the cosmetic, food, chemical and pharmaceutical industries.

Posts Tagged ‘appointments’

October 21st, 2008

Pack Expo 2008

The appointment with the most prestigious show of the U.S. packaging industry is at the McCormick Place in Chicago, from November 9th to 13th, 2008. PACK EXPO International will focus on the latest developments in packaging technology and will showcase exhibitors’ state-of-the-art advances in packaging machinery (fillers, cappers, Unscramblers and Orientors) converting machinery, materials, packages and containers, and components. 45,000 attendees are expected, including over 6,000 international visitors from more than 125 countries. (more…)